SK hynix AI Memory Dominates COMPUTEX 2026
COMPUTEX Taipei 2026 drew roughly 100,000 visitors from June 2 to 5 at the Taipei Nangang Exhibition Center, and SK hynix made sure its AI memory portfolio was impossible to miss.
Under the booth theme “At the core of the AI wave, Memory!,” SK hynix delivered a clear message: memory is the engine powering the AI industry’s expansion. A large LED display at the front of the booth used wave imagery and interconnected circuit patterns to bring that point to life visually.
The first stop for most visitors was the AI Factory Zone, designed to highlight SK hynix’s deep partnership with NVIDIA. The zone placed NVIDIA’s major products side by side with the SK hynix memory integrated inside them. NVIDIA’s DGX Spark supercomputer appeared alongside SK hynix’s LPDDR5X, which delivers ultra-fast computation for demanding AI workloads. Next to it, NVIDIA’s Bluefield4-DPU and Cold Plate Test Fixture were exhibited with SK hynix’s PEB210 E1.S enterprise SSD, developed specifically for high-performance thermal environments.
Further into the zone, the actual NVIDIA GB300 AI accelerator was on display with its integrated HBM3E. An “NVIDIA Partner Sign” bearing CEO Jensen Huang’s signature stood nearby as a symbol of the companies’ collaboration. Additionally, a model of NVIDIA’s upcoming Vera Rubin 200 superchip appeared alongside SK hynix’s SOCAMM2 and HBM4, with the tagline “Scalable AI with Confidence” signaling what comes next.
The Product Portfolio Zone, at the center of the booth, split into two sections. The AI Frontier & Industry Standards section featured SK hynix’s current flagship lineup. That included 12-layer 36GB HBM3E, 16-layer 48GB HBM4, and 12-layer 48GB HBM4E displayed together, a combination that drew the most crowd attention. Server DRAM products were also on show, including a 256GB 3DS RDIMM for high-capacity AI workloads and the world’s first RDIMM using 1c 10nm process technology, as well as a 128GB DDR5 MRDIMM built for high-bandwidth AI tasks.
The Infrastructure & Next-Gen section showcased what SK hynix sees as the future of AI memory. High Bandwidth Flash, or HBF, attracted notable attention as a next-generation concept that vertically stacks NAND using TSV technology, similar to HBM, and could shift the AI infrastructure paradigm. Also on display were ZUFS 4.1, which improves random read performance for LLMs, and LPCAMM2, combining multiple LPDDR5X chips into a single power-efficient module. The section also covered CXL 2.0+-based CMM-DDR5 and consumer SSD products targeting the AI PC market.
Beyond the technology on display, SK hynix added an unexpected crowd-pleaser. The Tarot Event Zone let visitors take a selfie, then used AI to generate an image blending traditional Korean attire with a personalized fortune-telling tarot card, a hit among Asian visitors with an interest in Korean Wave culture.
SK hynix stated that the event was an opportunity to demonstrate technology leadership alongside key partners, and that the company will stay attuned to AI trends to maintain its position in the global memory market.
