Xiaomi’s New Xring O3 Signals a Bigger Push Into Its Own Chip Technology
Quick Reads
- Xiaomi unveiled its new Xring O3 smartphone processor on August 24.
- Reuters sources say TSMC will manufacture the chip using its 3nm process.
- Xiaomi targets 200,000 to 300,000 shipments for its upcoming flagship foldable phone.
- The company also plans Xring chips for AI and autonomous driving.
Xiaomi is pushing deeper into chip development with its new Xring O3 processor, marking its second generation of in-house smartphone processors.
Reuters reports that two people familiar with the plans said TSMC will manufacture the Xring O3 using its 3nm process, while Xiaomi targets 200,000 to 300,000 shipments for an upcoming flagship foldable phone. The move shows Xiaomi wants greater control over the technology inside its devices while competing with companies such as Apple, Samsung, and Huawei, which also develop their own processors.
Xiaomi launched the Xring O1 in May 2025 and says devices powered by the processor have now surpassed one million cumulative shipments. The company has also expanded its chip ambitions beyond smartphones. Xiaomi said it contracted TSMC to produce the Xring O100, a 6nm neural processing unit designed to support its MiMo AI model, and the Xring D100, a 3nm chip designed for autonomous driving.
This gives Xiaomi a broader chip strategy that covers smartphones, AI and automotive technology. The Xring O3 could also strengthen Xiaomi’s position in China’s competitive foldable-phone market. Citing Smart Analytics Global, reports that Huawei held 68% of China’s foldable-phone market in the second quarter, while Honor held 13.7% and Oppo held 8.5%.
For Xiaomi, the Xring O3 represents more than a new processor. It could become a key part of Xiaomi’s attempt to control more of the technology behind its products and compete for a larger share of the premium smartphone market.
